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Stack Design Automation located in Silicon Valley, CA is working on holistic tools for end-to-end integrated design flow of next generation electronics hardware development including motes and tags for Internet-of-Things, Printed Electronics, Wearable Electronics, Stretchable Electronics, MEMS and Stacked 3DIC.  Leveraging our patent-pending design integration platform, we work closely with our customers to achieve the fastest path to design iterations, complemented by prototyping, testing and transfer to manufacture.

 

Our services include training and consulting services in backend of semiconductor manufacturing including wafer dicing and packaging, mechanical, electromechanical and industrial design, enclosure / chassis design, airflow and thermal simulation, thermal characterization and measurement.

 

 

 

 

 

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