Design Stacks

Our Gen-1 product release slated for late 2017 addresses the following technology topics:

- Electronic Packaging /3DIC / MEMS

- Printed Electronics

- Flexible Electronics

- Wearables

- Bioelectronics / Biomechanics

- Electromechanical

SDA is in the process of filing patent applications on our innovations in the above technology areas. We will feature more information in this section once that is complete. Please check back in a few weeks!